Curing of EHTPB-Based Adhesive Systems at Low Temperature

WANG Chen,LIU Yu-cun,YU Si-yu,LIU Yang-jun

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    Published By: Chinese Journal of Explosives & Propellants

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Chinese Journal of Explosives & Propellants ›› 2024, Vol. 47 ›› Issue (2) : 152-158. DOI: 10.14077/j.issn.1007-7812.202309016

Curing of EHTPB-Based Adhesive Systems at Low Temperature

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2024, 47(2): 152-158 https://doi.org/10.14077/j.issn.1007-7812.202309016

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