抛光垫提高化学机械抛光接触压强分布均匀性研究
吕玉山;张辽远;王军;王武刚
Contact Pressure Distribution During Chemical Mechanical Polishing with Bionic CuttingPolishing Pad
LU Yu-shan;ZHANG Liao-yuan;WANG Ju;WANG Wu-gang
兵工学报
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2012, (5): 617
-622
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DOI: 10.3969/j.issn.1000-1093.2012.05.019
