高过载环境下弹载电子封装焊点失效机理
刘启明, 樊铮炎, 李涛, 杨伟龙, 韩旭
Failure Mechanism of Solder Joints of Projectile-borne Electronic Package under High Overload Environment
LIUQiming, FANZhengyan, LITao, YANGWeilong, HANXu
兵工学报
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2025, (9): 241006
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DOI: 10.12382/bgxb.2024.1006
