瞬时大电流下微机电引信硅通孔封装的失效机理与实验研究
刘芳怡;娄文忠;丁旭冉;王辅辅;王瑛
The Failure Mechanism and Experimental Study of MEMS Fuze TSV Package at High Transient Current
LIU Fang-yi;LOU Wen-zhong;DING Xu-ran;WANG Fu-fu;WANG Ying
兵工学报
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2014, (9): 1356
-1362
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DOI: 10.3969/j.issn.1000-1093.2014.09.005
