Micromachining Processes for Si Microchannel Plates

WANG Guo-zheng;YUAN Yun-long;YANG Chao;LING Hai-rong;WANG Ji;YANG Ji-kai;LI Ye;DUANMU Qing-duo

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  • Sponsored by: China Association for Science and Technology (CAST)

    Editor-In-Chief: Xu Yida

    ISSN 1000-1093

    　

  • Hosted By: China Ordnance Society

    Published By: Acta Armamentarii

    CN 11-2176/TJ

Acta Armamentarii, a Chinese monthly journal, was first published in 1979. The journal is supervised by China Association for Science and Technology, sponsored by China Ordnance Society，and edited and published by Editorial Board of Acta Armamentarii. The Journal is included in all important domestic databases，and also collected by Engineering Index (EI, USA), Chemical Abstracts (CA, USA), Science Abstracts (SA, UK）, Abstract Journal (AJ, Russia), and Current Bibliography on Science and Technology(CBST).Acta Armamentarii has been selected into the journal Of Ordnance Science and Technology (Weapons Industry) Field Of High Quality Scientific and Technological Periodical Classification Catalogue (2022 edition), ranking T1, and the journal of Automotive Engineering Field of High Quality Scientific and technological Periodical classification Catalogue, ranking T2.
Acta Armamentarii ›› 2018, Vol. 39 ›› Issue (9) : 1804-1810. DOI: 10.3969/j.issn.1000-1093.2018.09.018
Paper

Micromachining Processes for Si Microchannel Plates

  • WANG Guo-zheng, YUAN Yun-long, YANG Chao, LING Hai-rong, WANG Ji, YANG Ji-kai, LI Ye, DUANMU Qing-duo
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Abstract

Microchannel plate (MCP) is a two-dimensional electronic multiplier widely used for detecting and imaging of electrons, ions, UV radiation, and X-ray. A method for fabricating Si-MCP was proposed and studied. Silicon microchannel arrays (SMA) are prepared by dry etching technology and electrochemical etching process, respectively. The characteristics of multiplex inductively coupled plasma (ICP) etching and photo-electrochemical etching are investigated and discussed. The results indicate that Si photo-electrochemical etching can be used to easily fabricate high aspect ratio microchannel arrays with smooth sidewall and sloped channel, and is more suitable for the preparation of Si-MCP. Si microchannel arrays with 6 μm spacing and more than 50 aspect ratio of microchannel were prepared. The insulation of Si-MCP substrate is solved using thick-layer oxidation. The continuous dynode is prepared by atomic layer deposition (ALD) process. Si-MCP samples were prepared. The measured results indicate that the electron gain of Si-MCP based on micromachining process is feasible.Key

Key words

siliconmicrochannelplate / photo-electrochemicaletching / atomiclayerdeposition / micromachining

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WANG Guo-zheng, YUAN Yun-long, YANG Chao, LING Hai-rong, WANG Ji, YANG Ji-kai, LI Ye, DUANMU Qing-duo. Micromachining Processes for Si Microchannel Plates. Acta Armamentarii. 2018, 39(9): 1804-1810 https://doi.org/10.3969/j.issn.1000-1093.2018.09.018

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第39卷
第9期2018年9月兵工学报ACTA
ARMAMENTARIIVol.39No.9Sep.2018

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