Formation of p-Type Silicon-based Deep Macropore Channel Array by Utilizing Electrochemical Etching Technology

Gao Yan-jun;Duan-mu Qing-duo;WANG Guo-zheng;LI Ye;TIAN Jing-quan

Acta Armamentarii ›› 2008, Vol. 29 ›› Issue (12) : 1497-1500. DOI: 10.3969/j.issn.1000-1093.2008.12.017
Paper

Formation of p-Type Silicon-based Deep Macropore Channel Array by Utilizing Electrochemical Etching Technology

  • Gao Yan-jun1,2, Duan-mu Qing-duo1, WANG Guo-zheng1, LI Ye1, TIAN Jing-quan1
Author information +
History +

Abstract

The formation of deep macropore channel array of p-type silicon in HF electrolyte was inves-tigated. Then a series of electrochemical etcnmg experiments and tests were carried out in three poles electrobath using different concentration HF electrolytes. The formation mechanism of deep macropore channel array of p-type silicon was theoretically described, and the relationship between the electro?chemical etching reaction and the HF concentration was given. It is shown that that HF concentration is a very important factor that determines whether electrochemical reaction is accomplished or not. The electrochemical etching method of p-type silicon macropore array in aqueous fluoride solutions is eco?nomic and practical for fabricating deep macropores. Theexperimental consequences are benefit to the electrochemical etching technology of silicon-based deep macropore array.

Key words

electrophysics / electrochemical etching / macropore array / HF / p-type silicon

Cite this article

Download Citations
Gao Yan-jun, Duan-mu Qing-duo, WANG Guo-zheng, LI Ye, TIAN Jing-quan. Formation of p-Type Silicon-based Deep Macropore Channel Array by Utilizing Electrochemical Etching Technology. Acta Armamentarii. 2008, 29(12): 1497-1500 https://doi.org/10.3969/j.issn.1000-1093.2008.12.017

References

[1] Beetz C P,Boerstler R W,Steinbeck J, et al. Silicon etching process for making microchannel plates : United States, 5,997, 713[P]. 1999-12-07.
[2] Lehmann V,Ronnebeck S. Ihe physics of macropore formation in low-doped p-type silicon [ J ] . J Electrocnem Soc, 1999,146
(8) : 2968-2975.
[3] Lehmann V,Foil H. Formation mechanism and properties of electrochemically etched trenches in n-type silicon [ J ] . J Elec- trochem Soc, 1990,137(2) : 653 - 658.
[4] Ottow S,Lehmann V, Foil H. Processing of three-dimensional microstructures using macroporous n-type silicon [ J ]. J Elec- trochem Soc, 1996, 143 : 385 — 390.
[5] Zhu Z H, Ye W M. Researchment of the transport property of photonic crystals by the application of the fininte-difference time- domain(FDTD) method[j]. J Acta Optica Sinica, 2003,23(5): 511-515.
[6] Rieger M M, Flake J C, Kohl P A. Alternatives to hydrogen flu?oride for photoelectrochemical etching of silicon [ J ]. J Electro?chemical Society, 1999,146(12) :4485 - 4489.
[7] Lust S, Clement C ju. Chemical limitations of macropore forma?tion on medium-doped p-type silicon [j ] . J Electrochemical Soci?ety, 2002,149(6) :C338 - C344.
[8] Wehrspohn R B, Chazalviel J N, Ozanam F. Macropore in highly resistive p-type crystalline silicon[J]. J Electrochemical Society, 1998,145(8):2958-2961.
[9] Ohji H, French P J,Tsutsumi K. Fabrication of mechanical structures in p-type silicon using electrochemical etching[J].Sen- sors and Actuators, 2000, 82: 254 - 258.
[10] Zhang X G. Morphology and formation mechanism of porous sil?icon [ J ].J Electrochem Soc, 2004, 151(1): C69 — C80 ?

283

Accesses

0

Citation

Detail

Sections
Recommended

/